Showing posts with label Electronics. Show all posts
Showing posts with label Electronics. Show all posts

Saturday, May 14, 2011

ppt wilson current mirror

wilson current mirror

ppt Static Induction Thyristor

Static induction thyristor (SITh) is a new kind of a high power, high frequency power semiconductor device based on the static induction effect proposed by Nishizawa. SITh belongs to the family of “static induction devices”.
An induced electrostatically potential barrier controls the current in static induction devices. The injection of the carrier is controlled by the electro-static field around the gate.

Download Ppt and Report 
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ppt Interconnect estimation for FPGA's

As density increases placement and routing for FPGAs need more careful attention to achieve successful design closure.
Interconnect during the design stage is the process of predicting the routing resource requirement that the design may pose at the later stage.
The design stage at which the estimation is done determines the reliability and accuracy that is demanded of the estimation method.
The estimation at this stage should track modern back end routers so that the design meets the requirements. 

3D Integrated Circuits (3D IC)

3D IC is approaching the centre of activity in the semiconductor business with many justified theoretical reasons and convincing technical results. The unprecedented growth of the computer and the Information technology industry is demanding Very Large Scale Integrated (VLSI) circuits with increasing functionality and performance at minimum cost and power dissipation. VLSI circuits are being aggressively scaled to meet this Demand, which in turn has some serious problems for the semiconductor industry.
With skyrocketing cost for lithography and IC fabrication 3D IC seems clearly a way to go. The question is when, and in what applications first. Despite many papers on the processing and assembly technology and design methodology for 3D IC, there are, however, a horde of problems yet to be solved. Roughly these issues are classified into process technology, manufacturing, thermal-related, applications-related, or design.
For each of these problems there will be either some solutions or detours; technology and manufacturing issues will be solved, thermal physics have to be obeyed and some good guidelines and design methods will be developed in time. Eventually commercial 3D IC will make its debut first in application areas where cost issue prefers 3D IC to 2D implementation or SiP.
Mobile, ubiquitous, and medical applications will be serious markets for 3D IC, because of the clear and urgent need for low energy consumption, functional integration, reliability, and low/medium cost in those applications. These application calls for independent or autonomous devices in that they not only perform a spectra of functions from sensing, conversion, storage, processing, and external wireless interaction but also monitoring and managing the energy resource according to the dynamic workload estimation. Deploying independent/autonomous systems on 3D IC to these market is expected be quite relevant in a near future due to the technology readiness, cost affordability, and rising applications demand. Additionally heterogeneous integration of different technologies in one single chip (SoC) is becoming increasingly desirable, for which planar (2-D) ICs may not be suitable. 3-D ICs are an attractive chip architecture that can alleviate interconnects related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip (SoC). The multi-layer chip industry opens up a whole new world of design. With the Introduction of 3-D ICs, the world of chips may never look the same again.

Wednesday, May 11, 2011

Paper Presentation and seminar Topics

Paper Presentation and seminar Topics collection:

1. 4G Wireless Systems
2. A BASIC TOUCH-SENSOR SCREEN SYSTEM
3. Artificial Eye
4. Animatronics
5. Automatic Teller Machine
6. Aircars
7. Adding interlligence to ineternet using satellite
8. ADSL
9. Aeronautical Communications
10. Agent oriented programing
11. Animatronics
12. Augmented reality
13. Autonomic Computing
14. Bicmos technology
15. BIOCHIPS
16. Biomagnetism
17. Biometric technology
18. BLUE RAY
19. Boiler Instrumentation
20. Brain-Computer Interface
21. Bluetooth Based Smart Sensor Networks
22. BIBS
23. CDMA Wireless Data Transmitter
24. Cellonics Technology
25. Cellular Positioning
26. Cruise Control Devices
27. Crusoe Processor
28. Cyberterrorism
29. Code division duplexing
30. Cellular Digital Packet Data
31. Computer clothing
32. Cordect WLL
33. CARBIN NANO TUBE ELECTRONICS
34. CARNIVORE AN FBI PACKET SNIFFER
35. CDMA
36. CELLONICSTM TECHNOLOGY
37. CELLULAR NEURAL NETWORKS
38. CELLULAR DIGITAL PACKET DATA
39. CIRCUIT AND SAFETY ANALYSIS SYSTEM
40. CISCO IOS FIREWALL
41. CLUSTER COMPUTING
42. COLD FUSION
43. COMPACT PCI
44. COMPUTER AIDED PROCESS PLANNING (CAPP)
45. COMPUTER CLOTHING
46. COMPUTER MEMORY BASED ON THE PROTEIN BACTERIO
47. CONCEPTUAL GRAPHICS
48. CORDECT
49. CORDECT WLL
50. CRUISE CONTROL DEVICES
51. CRUSOE PROCESSOR
52. CRYOGENIC GRINDING
53. CRYPTOVIROLOGY
54. CT SCANNING
55. CVT
56. Delay-Tolerant Networks
57. DEVELOPMENT OF WEARABLE BIOSENSOR
58. DiffServ-Differentiated Services
59. DWDM
60. Digital Audio Broadcasting
61. Digital Visual Interface
62. Direct to home television (DTH)
63. DOUBLE BASE NUMBER SYSTEM
64. DATA COMPRESSION TECHNIQUES
65. DELAY-TOLERANT NETWORKS
66. DENSE WAVELENGTH DIVISION MULTIPLEXING
67. DESIGN, ANALYSIS, FABRICATION AND TESTING OF A COMPOSITE LEAF SPRING
68. DEVELOPMENT OF WEARABLE BIOSENSOR
69. DGI SCENT
70. DIFFFSERVER
71. DIGITAL AUDIO BROADCASTING
72. DIGITAL CONVERGENCE
73. DIGITAL HUBBUB
74. DIGITAL SILHOUETTES
75. DIGITAL THEATRE SYSTEM
76. DIGITAL WATER MARKING
77. DIRECT TO HOME
78. DISKLESS LINUX TERMINAL
79. DISTRIBUTED FIREWALL
80. DSL
81. DTM
82. DWDM
83. DYNAMIC LOADABLE MODULES
84. DYNAMICALLY RECONFIGURABLE COMPUTING
85. ELECTROMAGNETIC INTERFERENCE
86. Embedded system in automobiles
87. Extreme Programming
88. EDGE
89. ELECTROMAGNETIC LAUNCHING SYSYEM
90. E BOMB
91. E INTELLIGENCE
92. E PAPER TECHNOLOGY
93. ELECTRONIC DATA INTERCHANGE
94. ELECTRONIC NOSE
95. ELECTRONIC NOSE & ITS APPLICATION
96. ELECTRONICS MEET ANIMALS BRAIN
97. EMBEDDED
98. EMBEDDED DRAM
99. EMBEDDED LINUX
100. EMBRYONICS APPROACH TOWARDS INTEGRATED CIRCUITS
101. EMNA
102. EUVL
103. EXT3
104. EXTREME PROGRAMMING
105. EXTREME ULTRAVIOLET LITHOGRAPHY
106. Ferroelectric RAM
107. Fluorescent Multi-layer Disc
108. Face detection technology
109. FSO transmitter
110. FACE RECOGNITION TECHNOLOGY
111. FIREWIRE
112. FRACTAL IMAGE COMPRESSION
113. FRACTAL ROBOTS
114. FRAM
115. FREE SPACE OPTICS
116. FREQUENCY SHIFT KEYING
117. FUTEX
118. Ga m i n g c o n s o l e s
119. GMPLS
120. GSM Security And Encryption
121. Guided Missiles
122. Green engine
123. GAMING CONSOLES
124. GENERAL PACKET RADIO SERVICE
125. GENETIC PROGRAMMING
126. GEOGRAPHIC INFORMATION SYSTEM
127. GLOBAL POSITIONING SYSTEM
128. GLOBAL SYSTEM FOR MOBILE COMMUNICATION (GSM)
129. GMPLS
130. GRAPHICS PROCESSING UNIT
131. GREEN ENGINE
132. GRID COMPUTING
133. GENERAL PACKET RADIO SERVICE
134. GRAPHICS PROCESSING UNIT
135. H.323
136. HALO NETWORK
137. HANDFREE DRIVING
138. HANS
139. HIGH ALTITUDE AERONAUTICALl PLATFORM STATIONS
140. HIGH AVAILABILITY LINUX CLUSTERING
141. HIGH TEMPERATURE SUPERCONDUCTORS
142. HIGH-AVAILABILITY POWER SYSTEMS
143. HOLOGRAPHIC MEMORY
144. HPJAVA
145. HTAM
146. HUMAN COMPUTER INTERFACE
147. HURD
148. HVAC
149. HYDRO DRIVE
150. HYPER THREADING
151. HYPER TRANSPORT TECHNOLOGY
152. HYPERTEXT PREPROCESSOR (PHP)
153. HY-WIRE CAR
154. H_323
155. High Altitude Aeronautical Platforms
156. Home Networking
157. Holographic memory
158. Hyperthreadimax
159. high speed data
160. Honeypots
161. HPJava
162. Human Computer Interface
163. Hurd
164. InfiniBand
165. Intelligent calling bell
166. INFINITE DIMENSIONAL VECTOR SPACES
167. Intel MMX
168. INTRUSION DETECTION SYSTEMS
169. Ipv6 - The Next Generation Protocol
170. Iris Scanning
171. I MODE
172. IDC
173. IDS
174. ISI
175. IGCT
176. IMAGE AUTHENTICATION TECHNIQUES
177. IMAX
178. INFINI BAND
179. INFINITE DIMENSIONAL VECTOR SPACES
180. INTEGRATED POWER ELECTRONICS MODULE
181. INTEGRATION OF INFORMATION TECHNOLOGY IN MACHINE TOOLS
182. INTEL CENTRINO MOBILE TECHNOLOGY
183. INTEL MMX
184. INTELLIGENT NAVIGATION SYSTEM
185. INTELLIGENT NETWORK
186. INTELLIGENT SOFTWARE AGENTS
187. INTERACTIVE VOICE RESPONSE SYSTEM
188. INTERNET ARCHITECTURE AND ROUTING
189. IP SPOOFING
190. IRIS SCANNING
191. ISOLOOP MAGNETIC COUPLERS
192. ITANIUM PROCESSOR
193. Integrated Power Electronics Module
194. Integration of information technology in machine tools
195. INTEL CENTRINO MOBILE TECHNOLOGY
196. Interactive Voice Response System
197. JAVA CARD
198. JAVA MESSAGE SERVICE
199. Javaring
200. Josephson junction
201. KIRLIAN PHOTOGRAPHY
202. LANDMINES DETECTION
203. LASER & SATELLITE GUIDED STRIKERS
204. LASER COMMUNICATION
205. LED WIRELESS
206. LIGHT EMITTING POLYMERS
207. LIGHTNING PROTECTION USING LFA-M
208. LIGHT-TREE
209. LINE REFLECT REFLECT TECHNIQUE
210. LINTO
211. LINUX IN EMBEDDED SYSTEMS
212. LMDS
213. LOW POWER UART DESIGN FOR SERIAL DATA COMMUNICATION
214. LWIP
215. Light controlled fan regulator
216. Laser Communications
217. Layer 3 switching
218. Lazer communication
219. LED WIRELESS
220. LIGHT-TREE
221. LIWIA3
222. LRR
223. Managing Data In Multimedia Conferencing
224. Microsoft Windows Distributed internet application architect
225. Migration from GSM network to GPRS
226. Minidisc
227. Moct
228. Modular Computing
229. MPEG-7
230. Mobile IP
231. Molecular Electronics
232. Multisensor Fusion and Integration
233. MAGNETIC RAM
234. MANAGING DATA IN MULTIMEDIA CONFERENCING
235. M-COMMERCE
236. MICRO ELECTROMECHANICAL SYSTEM (MEMS)
237. MICRO ELECTRONIC PILL
238. MICROSOFT PALLADIUM
239. MICROSOFT WINDOWS DISTRIBUTED INTERNET APPLICATION ARCHITECT
240. MIGRATION FROM GSM NETWORK TO GPRS
241. MILLIPEDE
242. MINI DISC
243. MOBILE IP
244. MOBILE TELEMEDICINE SYSTEMS
245. MOCT
246. MODULAR COMPUTING
247. MODULAR ROBOTICS
248. MOLECULAR ELECTRONICS
249. MP3 ENCODING
250. MPEG
251. MPEG-7
252. MRAM
253. MULTI PROTOCOL LABEL SWITCHING
254. MULTI SENSOR FUSION AND INTEGRATION
255. MULTICAST
256. MULTIMEDIA MESSAGING SERVICE (MMS)
257. MULTITERABIT NETWORKS
258. mems
259. Nanotechnology
260. NAS
261. NVT
262. NRAM
263. NANOTECHNOLOGY
264. NARROWBAND AND BROADBAND ISDN
265. NAVBELT AND GUIDECANE
266. NETWORK ATTACHED STORAGE (NAS)
267. NEURAL NETWORKS AND THEIR APPLICATIONS
268. NON VISIBLE IMAGING
269. NRAM
270. Optical Satellite Communication
271. OOT
272. OPEN RAN
273. OPEN SOURCE DEVELOPMENT WITH CVS
274. OPTICAL COHERENCE TOMOGRAOHY
275. OPTICAL ETHERNET
276. OPTICAL PACKET SWITCHING
277. OPTICAL PACKET SWITCH ARCHITECTURES ORIGINAL
278. OPTICAL SATELLITE COMMUNICATION
279. OPTICAL SWITCHING
280. ORGANIC ELECTRONICS
281. ORGANIC LED
282. ORION - CEV
283. OVONIC UNIFIED MEMORY
284. OpenRAN
285. Optical coherence tomography
286. Organic Electronics
287. Organic Light Emitting Diodes
288. Optical Computing
289. Optical switching
290. Ovonic unified memory
291. PARASITIC COMPUTING
292. PH Control Technique using Fuzzy Logic
293. Pivot Vector Space Approach in Audio-Video Mixing
294. Polymer Memory
295. PRODUCTIONAND MANUFACTURING ISSUES
296. Passive integration
297. Plasma Display
298. Project Oxygen
299. PebbleBedReactors
300. PALLADIUM
301. PARA LEGAL AID PROGRAMME
302. PARALLEL COMPUTING IN INDIA
303. PARASITIC COMPUTING
304. PASSIVE INTEGRATION
305. PERCEPTIVE COMPUTING
306. PH CONTROL TECHNIQUE USING FUZZY LOGIC
307. PIVOT VECTOR SPACE APPROACH IN AUDIO-VIDEO MIXING
308. PIXIE DUST
309. PLAN 9 OPERATING SYSTEM
310. PLASMA ANTENNAS
311. PLASMA ARC TECHNOLOGY
312. PLASTIC ELECTRONICS
313. PLASTIC CHIPS
314. POLYMER MEMORY
315. POWER SYSTEM CONTIGENCIES
316. PRIORITY INV & CHAIN BLOCKING
317. PROJECT OXYGEN
318. PROTEIN BASED DNA COMPUTERS
319. PROTEIN ARCHITECTURE
320. PROTEIN MEMORY
321. PROTEOMICS
322. Power line communication
323. Q HEAP
324. QOS IN CELLULAR NETWORKS BASED ON MPT
325. QUADRICS INTERCONNECTION NETWORK
326. QUANTUM COMPUTING
327. QUANTUM CRYPTOGRAPHY
328. QUANTUM TELEPORTATION
329. QUANTUM_COMPUTING
330. RADIO FREQUENCY IDENTIFICATION
331. RAOOF
332. RAPID PROTOTYPING
333. RD RAM
334. RE ENTRY OF SPACE VEHICLE
335. REAL FAIR
336. RECONFIGURABLE COMPUTING
337. RESILIENT PACKET RING NETWORKS
338. ROBOTICS
339. Robotic surgery
340. Radio frequency light sources
341. RD ram
342. RESILIENT PACKET RING Networks
343. RFID technology
344. RTOS - Vx WORKS
345. RAID
346. RPR
347. SATRACK
348. Solar cars
349. Search For Extraterrestrial Intelligence
350. Simputer
351. Smart Note Taker
352. Single photon emission computed tomography
353. Smart card
354. Speed Detection of moving vehicle using speed cameras
355. Stealth Fighter
356. Surround Sound System
357. Satellite radio
358. SALT
359. SAP R3 ARCHITECTURE
360. SATELLITE RADIO
361. SATRACK
362. SEASONAL INFLUENCES ON SAFETY OF SUBSTATION GROUNDING SYSTEMS
363. SECURITY FEATURES IN SE-LINUX
364. SELF MANAGING COMPUTING SYSTEM
365. SELF ORGANIZING MAPS
366. SENSORS ON 3D DIGITIZATION
367. SENSOTRONIC BRAKE CONTROL
368. SESSION INITIATION PROTOCOL
369. SILC
370. SIMPUTER
371. SKID STEER LOADER AND MULTIERRAIN LOADER
372. SMART CAMERA FOR TRAFFIC SURVIELLANCE
373. SMART CARDS
374. SMART DUST
375. SMART EDIT
376. SMART PIXEL ARRAYS
377. SMART QUILL
378. SMART SENSOR
379. SMF COUPLER
380. SOFTWARE IN MEDICAL IMAGING
381. SPACE AHUTTLES AND ITS ADVANCEMENTS
382. SPACE MOUSE
383. SPACE ROBOTICS
384. SPECT
385. SPEECH RECOGNITION
386. SPEED DETECTION OF MOVING VEHICLE USING SPEED CAMERAS
387. SPIN VALVE TRANSISTOR
388. SPINTRONICS
389. STEGANOGRAPHY
390. STORAGE AREA NETWORKS (SAN)
391. SURROUND SOUND SYSTEM
392. SURVIVABLE NETWORKS SYSTEM
393. SYMBIAN
394. SYNCHRONISATION
395. SYNTHETIC APERTURE RADAR SYSTEM
396. Self managing computing system
397. Sensors on 3d digitisation
398. Shallow water Acoustic Networks
399. Sisco
400. Smart Pixcell Arrays
401. SMART SENSOR
402. Survivable Networks Systems
403. Solar power satelite
404. Self Organizing Maps
405. Survivable Networks Systems
406. TETRA-TErrestrial Trunked Radio
407. Temperature controller cum indicator
408. TELE-IMMERSION
409. TEMPEST AND ECHELON
410. TEN 10 GIGABIT ETHERNET
411. THE ANATOMY OF GRID
412. THE TIGERSHARC PROCESSOR
413. THERMAL BARRIER COATING
414. THIRD GENERATION OF MOBILE PHONES(3G)
415. THOUGHT TRANSLATION DEVICE (TTD)
416. TOTAL PRODUCTIVE MAINTENANCE
417. TOUCH SCREEN REPORT
418. TREATING CARDIAC DISEASES BASED ON CATHETER BASED TISSUE HEATING
419. TRIPWIRE
420. TEN GB ETHERNET
421. UBIQUITOUS COMPUTING
422. ULTRA WIDE BAND TECHNOLOGY
423. UNICODE SUPPORTS SOLARIS OPERATING ENVIRONMENT
424. UTILITY FOG
425. VISNAV
426. Voice morphing
427. VDSL
428. VIRTUAL KEYBOARD
429. VIRTUAL LAN TECHNOLOGY
430. VIRTUAL NETWORK COMPUTING
431. VIRTUAL SURGERY
432. VISIONS OF 4G
433. VISNAV
434. VISUALISATION
435. VLSI COMPUTATIONS”
436. VOCABLE
437. VOICE MORPHING
438. VOICE OVER INTERNET PROTOCOL
439. VOICE PORTALS
440. VPN
441. VLSI COMPUTATIONS”
442. VOICE PORTALS
443. Virtual Typing
444. Virus & Anti viruses
445. Virtual Network Computing
446. VoCable
447. VPN
448. Wearable Computers
449. WAKE ON LAN
450. WAVELET TRANSFORMS
451. WAVELET VIDEO PROCESSING TECHNOLOGY
452. WDM
453. WEARABLE COMPUTERS
454. WELDING ROBOTS
455. WIDEBAND- OFDM
456. WIDEBAND SIGMA DELTA PLL MODULATOR
457. WI-FI WIRELESS FIDELITY
458. WINDOWS VISTA
459. WIRELESS INTERNET SECURITY
460. WIRELESS LAN-IEEE 802.11
461. WIRLESS INTELLEGENT NETWORKING
462. WISE NET
463. Wearable Bio-Sensors
464. White LED
465. Wireless Integrated Network Sensors
466. Wankel Engine
467. WI FI-wireless fidility
468. XML ENCRYPTION
469. ZIGBEE

Sunday, May 8, 2011

pdf eCos (Embedded Configurable Operating system)

Download an article on eCos (Embedded Configurable Operating system)

Thursday, April 7, 2011

IEEE Global History Network

The IEEE Global History Network (GHN) is a wiki with content generated only by IEEE members and invited experts. The IEEE Global History Network intends to be the world’s premier site for the documentation, analysis and explanation of the history of electrical, electronic, and computer technologies, the scientists, engineers and business people who made these technologies happen, and on the history of the organizations to which these men and women belonged. The IEEE GHN fosters the creation of narratives that not only document the history engineering practice but also explain when, how and why these myriad of technologies developed as they did. It uses a wiki-based web platform to foster a collaborative online environment that taps into the collective memories, experiences, and knowledge of IEEE’s worldwide membership – the men and women who provide the imagination, creativity, and know-how to sustain the progress in electrical, electronic, and computer innovations. In time, this site will serve as a central historical repository of all the achievements, ideas, and first-hand knowledge of IEEE members, societies, councils and technical communities. The IEEE GHN will also provide a central location for all materials related to IEEE’s organizational history. 
The IEEE GHN is not a “how-does-technology-work” site. The IEEE GHN is not an encyclopedia of the history of technology. Although it does contain Wikipedia-like “topic articles” that cover general subjects within the broader context of technological history, it also contains the full range of materials that relate to the legacy of science and technology, including personal accounts, documents, and multimedia objects. In that sense, it is a combination reference guide, blog, virtual archive, and on-line community. 
The GHN serves the public as a definitive and reliable website of record, and will raise the public visibility of the role and historical contributions of the IEEE, IEEE members, engineers, and related professionals in enhancing the quality of life and the global environment.
Unlike other on-line encyclopedias that may include technological topics, the IEEE GHN will be solely focused on the history technology. The IEEE GHN’s content will also be unique. No other wiki site offers the personal accounts of the technical innovators themselves. In other words, the IEEE GHN serves as a living, electronic memory of all the important experiences and contributions made by IEEE members and others to technological progress — from around the globe.

Saturday, November 20, 2010

Memristor "the fourth fundamental electronic element" (report) download for free

A memristor (pronounced "memory resistor") is a passive two-terminal circuit element in which the resistance is a function of the history of the current and voltage through the device. Memristor theory was formulated and named by Leon Chua in a 1971 paper.
On April 30, 2008, a team at HP Labs announced the development of a switching memristor based on a thin film of titanium dioxide. It has a regime of operation with an approximately linear charge-resistance relationship as long as the time-integral of the current stays within certain bounds. devices are being developed for application in nanoelectronic memories, computer logic, and neuromorphic computer architectures.


Memristor "the fourth fundamental electronic element"(ppt)
 

 
Memristor "the fourth fundamental electronic element" (report)